HTL Co. India Pvt. Ltd.

Semiconductor & Equipment Solutions

Gemini(AOI tool)

Advanced Die-to-Database Inspection System

High-Speed. High-Resolution. Intelligent Defect Detection

A powerful inspection solution designed for advanced semiconductor manufacturing. This system delivers precise, high-speed die-level inspection with intelligent algorithms that detect critical defects without dependency on repeating patterns.

Engineered for accuracy, efficiency, and real-time review, it enables manufacturers to maintain the highest quality standards throughout the production process.

Product Specifications

Key Features

  • High-Speed, High-Resolution Inspection

    Performs die-to-database and die-to-die inspections with exceptional speed and image clarity, enabling accurate detection of minute defects.

  • Advanced Contact Hole Algorithm
    Specialized algorithm designed for contact hole patterns, eliminating the need for repeating patterns and improving detection accuracy on complex layouts.

  • Enhanced Difference Comparison
    An optimized simple difference comparison algorithm ensures reliable defect identification with minimal false positives.

  • In-Process Concurrent Review

    Built-in in-process review function captures both transmission and reflection images of detected defects for immediate analysis and decision-making.

  • Simultaneous Transmission & Reflection Imaging
    Conducts transmission and reflection inspections at the same time, providing a complete view of defect characteristics in a single scan.

     

Applications

  • Semiconductor wafer inspection

  • Advanced logic and memory devices

  • Contact hole and critical layer inspection

  • Yield monitoring and process optimization

  • R&D and high-volume manufacturing environments

Benefits to Your Workflow

  • Improved yield: Early and accurate defect detection

  • Reduced inspection time: High-speed scanning and real-time review

  • Greater flexibility: Effective even on non-repetitive patterns

  • Enhanced accuracy: Dual-mode imaging for deeper defect insight

  • Process confidence: Reliable inspection at every stage

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Catalog

Technical Overview

Specification

Typical Value

Imprint Modes

Thermal (up to 250 °C) / UV (365 nm or 405 nm)

Substrate Size

Up to Ø120 mm or Ø210 mm

Minimum Feature Size

~100 nm

Supported Materials

Thermoplastics, UV resists, glass, silicon, polymers

Operation

Manual or semi-automated

System Size

Compact desktop configuration

Configuration Options

20+ variants for chamber, UV source, and control interface

Contact us to

Request a demo or sample imprint

Discuss your application needs

Get configuration and pricing details

HTL Co. India Pvt. Ltd.

Semiconductor & Equipment Solutions

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