A powerful inspection solution designed for advanced semiconductor manufacturing. This system delivers precise, high-speed die-level inspection with intelligent algorithms that detect critical defects without dependency on repeating patterns.
Engineered for accuracy, efficiency, and real-time review, it enables manufacturers to maintain the highest quality standards throughout the production process.
High-Speed, High-Resolution Inspection
Performs die-to-database and die-to-die inspections with exceptional speed and image clarity, enabling accurate detection of minute defects.
Advanced Contact Hole Algorithm
Specialized algorithm designed for contact hole patterns, eliminating the need for repeating patterns and improving detection accuracy on complex layouts.
Enhanced Difference Comparison
An optimized simple difference comparison algorithm ensures reliable defect identification with minimal false positives.
In-Process Concurrent Review
Built-in in-process review function captures both transmission and reflection images of detected defects for immediate analysis and decision-making.
Simultaneous Transmission & Reflection Imaging
Conducts transmission and reflection inspections at the same time, providing a complete view of defect characteristics in a single scan.
Semiconductor wafer inspection
Advanced logic and memory devices
Contact hole and critical layer inspection
Yield monitoring and process optimization
R&D and high-volume manufacturing environments
Improved yield: Early and accurate defect detection
Reduced inspection time: High-speed scanning and real-time review
Greater flexibility: Effective even on non-repetitive patterns
Enhanced accuracy: Dual-mode imaging for deeper defect insight
Process confidence: Reliable inspection at every stage
Specification | Typical Value |
Imprint Modes | Thermal (up to 250 °C) / UV (365 nm or 405 nm) |
Substrate Size | Up to Ø120 mm or Ø210 mm |
Minimum Feature Size | ~100 nm |
Supported Materials | Thermoplastics, UV resists, glass, silicon, polymers |
Operation | Manual or semi-automated |
System Size | Compact desktop configuration |
Configuration Options | 20+ variants for chamber, UV source, and control interface |
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