HTL Co. India Pvt. Ltd.

Semiconductor & Equipment Solutions

SPS POLOS WAFER SCRIBERS

High-Precision Wafer Scribing Systems for Semiconductor & Research Applications

for wafer scribing, substrate cutting, sample preparation, and device singulation. Available in 4″, 8″, and 12″ configurations, these laboratory-scale systems deliver excellent edge quality, high repeatability, and minimal substrate damage across a wide range of materials.

Designed for semiconductor laboratories, MEMS fabrication, photonics, nanotechnology, and materials research, POLOS wafer scribers combine ergonomic operation, adjustable pressure control, and precision-guided cutting for reliable wafer separation and prototyping workflows.

Product Specifications

Our Special Lighting Solutions

  • High-Precision Wafer Scribing

    Precision-guided cutting enables repeatable wafer separation with cutting accuracy better than 0.1 mm and fine adjustment accuracy up to ±50 µm.

     
  • Adjustable Pressure Control

    Integrated spring-loaded pressure adjustment ensures consistent scribing force, reducing cracking, chipping, and substrate damage.

     
  • Diamond & Carbide Wheel Options

    Optimized wheel materials support a broad range of wafer types:

    • Carbide wheels for Silicon and Glass
    • Diamond wheels for Sapphire and SiC
    • Suitable for hard and brittle materials
  • Wide Material Compatibility

    Compatible with:

    • Silicon wafers
    • Sapphire substrates
    • SiC wafers
    • Quartz and fused quartz
    • Glass substrates
    • ITO, FTO and AZO coated glass
    • Crystalline materials
     
  • Precision Magnetic Guide System

    Stable substrate positioning improves cut accuracy, dimensional consistency, and process repeatability.

     
  • Compact Laboratory Design

    Lightweight bench-top construction enables easy integration into cleanrooms, research laboratories, and prototyping facilities.

Optional Accessories

Available accessories include:

  • Film cutting head attachment
  • Protective cutting mats
  • Magnifier holders
  • 5× inspection magnifier

Applications

Semiconductor Wafer Processing

Accurate wafer scribing and substrate separation with excellent edge quality and minimal damage.

MEMS & Microfabrication

Ideal for sample preparation, prototype fabrication, and micro-device development.

Photonics & Optoelectronics

Supports precision cutting of optical substrates and specialty materials.

Materials Research & Universities

Compact and user-friendly design makes it suitable for R&D laboratories, cleanrooms, and academic research facilities.

Device Singulation & Sample Preparation

An efficient solution for low-volume production, process development, and laboratory wafer preparation.

 

Key Benefits

  • Supports 4″, 8″, and 12″ wafer formats
  • High cutting accuracy and repeatability
  • Adjustable pressure control for consistent results
  • Diamond and carbide wheel compatibility
  • Excellent edge quality with reduced chipping
  • Compact, ergonomic, and cleanroom-friendly design
  • Suitable for Silicon, Sapphire, SiC, Quartz, and Glass substrates
  • Cost-effective alternative to large wafer dicing systems

Catalog

Product Range

Specification

4″ Wafer Scriber

8″ Wafer Scriber

12″ Wafer Scriber

Cutting Wheel

Diamond or Carbide

Diamond or Carbide

Diamond or Carbide

Suitable Thickness

0.05 – 3.0 mm

0.05 – 3.0 mm

0.05 – 3.0 mm

Spring Pressure

0 – 50 N

0 – 50 N

0 – 50 N

Cutter Height Range

0 – 5 mm

0 – 5 mm

0 – 5 mm

Maximum Cut Length

110 mm

210 mm

310 mm

Wheel Length

26 ± 0.05 mm

26 ± 0.05 mm

26 ± 0.05 mm

Base Plate

Anodized Super-Flat Aluminum Alloy

Anodized Super-Flat Aluminum Alloy

Anodized Super-Flat Aluminum Alloy

Dimensions (W × D × H)

210 × 210 × 136 mm

310 × 310 × 136 mm

410 × 410 × 136 mm

Weight

1.37 kg

2.41 kg

4.25 kg

 

Reliable Wafer Preparation for Research & Prototyping

SPS POLOS Wafer Scribers provide accurate and repeatable wafer cutting for semiconductor, MEMS, photonics, and materials research applications. With flexible substrate compatibility, adjustable cutting control, and multiple wafer size options, they offer an efficient solution for laboratory-scale wafer processing and device preparation

Contact us to

  • Request detailed technical specifications
  • Compare wafer size configurations
  • Discuss substrate compatibility
  • Schedule a product demonstration

HTL Co. India Pvt. Ltd.

Semiconductor & Equipment Solutions

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