HTL Co. India Pvt. Ltd.

Semiconductor & Equipment Solutions

ESTION E-Wafer

E-Wafer

In-Line Electrostatic Risk Analyser for Semiconductor Wafers
Live Charge Monitoring. Defect Prevention. Process Control.

The E-Wafer by ESTION is a wafer instrumented with embedded sensors, designed to measure electrostatic charges in real time during standard production. By integrating measurement directly into a 200 mm or 300 mm wafer, it provides in-situ insight throughout the full manufacturing process — not just at static test points.

Whether you’re running automated wafer fabs, developing process flows, or tracking electrostatic-induced defects, the E-Wafer unearths the hidden risks so you can improve yield, reduce particle build-up, and prevent electrostatic discharge events.

Product Specifications

Key Features

  • Embedded Electrostatic Sensors

    Sensors are built into eight distinct regions of the wafer, measuring potential differences across its surface to detect charge accumulation and risky zones.
  • Continuous In-Process Monitoring

    Real-time data capture throughout handling, processing, and movement gives you a full picture of when and where charge builds up.

  • On-Board Logging & Wireless Access

    With an integrated real-time clock, internal memory, and Wi-Fi connectivity, all measurements are recorded and can be easily retrieved for analysis.

       Seamless Integration into Production

  • For 300 mm wafers: docking station designed to fit into a standard FOUP for automated processing.
  • Process Analytics Software
    Supplied software helps analyse the logged data, pinpoint critical electrostatic hotspots, and drive actionable improvements.

Applications

The E-Wafer is especially useful for:

  • Semiconductor fabs looking to minimize ESD-related defects
  • Process development teams aiming to understand static behaviour in new process flows
  • Quality and yield engineers conducting root cause analysis for particle contamination
  • R&D labs testing new handling, grounding, or charge mitigation strategies
  • Production teams integrating real-time static monitoring into automated manufacturing

Why It Matters

Electrostatic charge poses several serious risks during wafer manufacturing:

  • Electrostatic Discharge (ESD) Damage
    Micro-discharges can damage delicate structures, especially as feature sizes shrink.
  • Particle Attraction
    Static fields attract particles, leading to more defects and contamination
  • Film Non-uniformity
    During wet processing, charge imbalances can distort deposition or etching, degrading film quality.

By exposing when and where these risks happen, the E-Wafer helps engineers to:

  • Identify high-risk process steps
  • Adjust handling or grounding strategies
  • Reduce defect rates and scrap
  • Improve overall process robustness and yield.

Catalog

Technical Overview

Specification

Detail

Wafer Sizes

200 mm or 300 mm

Sensor Zones

8 independent areas across the wafer surface

Data Logging

On-board memory with real-time timestamping

Connectivity

WLAN for wireless data download

Docking Options

300 mm FOUP dock; 200 mm SMIF or open cassette; portable dock for R&D

Usage Mode

Inline production monitoring or standalone risk analysis

Contact us to

Request a demo of the E-Wafer in your process

Explore how it fits into your 200 mm or 300 mm fab

Start a static-risk audit or process evaluation

Discuss custom configurations or data-analysis integration

HTL Co. India Pvt. Ltd.

Semiconductor & Equipment Solutions

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