Tekscend Nanoimprint Molds are built to be the foundation of your nanoimprint process. Whether you’re developing next-generation optics, advanced photonics, or micro-structured surfaces, our molds help you move from design to perfectly replicated patterns with confidence.
Using the same high-end fabrication expertise that goes into semiconductor photomasks, we create molds that deliver exceptional fidelity, consistency, and long-term durability.
With Tekscend, you get molds you can rely on cycle after cycle.
Two mold formats for every need
Choose quartz molds for UV nanoimprinting or silicon molds for thermal imprinting. Each is engineered for smooth, stable, and high-resolution pattern transfer.
Extremely fine detail
Our molds can reproduce features down to just tens of nanometers, maintaining crisp edges and uniform depth—even across large areas.
Built for stability
Quartz provides excellent flatness and optical clarity, while silicon supports deep, high aspect-ratio structures. Both resist wear and deformation through repeated use.
Fully customizable patterns
Whether you need multi-level designs, meta-surfaces, slanted or blazed profiles, or complex 3D shapes, we can fabricate molds tailored to your exact specifications.
Scalable for any workflow
From small-scale R&D to full wafer-level manufacturing, our mold sizes—including 152 × 152 mm quartz plates and 200 mm silicon wafers—fit seamlessly into your production tools.
Manufactured with semiconductor precision
Every mold is shaped using advanced e-beam lithography, precise dry etching, and thorough inspection—ensuring the accuracy and repeatability your process depends on.
Tekscend nanoimprint molds are ideal for:
Specification | Typical Value |
Imprint Methods | UV (quartz molds) / Thermal (silicon molds) |
Mold Substrate | High-purity quartz or silicon wafer |
Max Substrate Size | 152 × 152 mm (quartz) / 200 mm wafer (silicon) |
Minimum Feature Size | Tens of nanometers |
Pattern Options | Multi-level, 3D, slanted, blazed, meta-surface structures |
Aspect Ratio | High aspect-ratio structures supported (silicon molds) |
Fabrication Method | E-beam lithography, precision dry etching |
Operation | Suitable for R&D through high-volume manufacturing |
Request a live demo or technical consultation
Discuss your lithography process or mask requirements
Receive production lead times and custom specifications
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