Tekscend Photomask

Advanced Photomasks for Semiconductor Lithography

Precision. Reliability. Next-generation patterning.
Enabling the circuits of tomorrow.

Tekscend Photomask delivers high-accuracy photomasks used across semiconductor manufacturing, from mature nodes to leading-edge lithography. Designed for maximum fidelity and stability, our masks support critical dimension accuracy, superior pattern transfer, and consistent performance across high-volume production.

From binary masks to phase-shift and EUV reflective masks, Tekscend provides a full portfolio engineered to meet the exacting demands of modern wafer fabrication.

Product Specifications

Key Features

Complete photomask portfolio
Binary masks, phase-shift masks (halftone and alternating), and EUV reflective masks supporting a wide range of lithography wavelengths and node requirements.
Exceptional pattern accuracy
High-fidelity circuit patterning with tight CD control, ensuring uniformity, resolution, and reproducibility across mask sets.
Advanced materials and blanks
Includes innovative mask blanks such as Opaque MoSi on Glass (OMOG), offering improved workability and superior optical performance.
Precision inspection and defect control
Comprehensive metrology, inspection, and repair processes ensure defect-free masks with outstanding pattern integrity.
High-volume manufacturing capability
Eight global manufacturing sites provide scalability, fast turnaround, and robust supply chain support for semiconductor fabs worldwide.
EUV-ready solutions
Reflective multilayer masks engineered for extreme ultraviolet lithography, enabling advanced node patterning with optimal reflectivity and surface quality.

Applications

Tekscend photomasks are ideal for:

Semiconductor device manufacturing
Advanced and mature node lithography
Logic, memory, power, and analog IC production
Display and optoelectronic patterning
R&D, prototyping, and specialty mask applications

Benefits to Your Workflow

High precision: Optimized for superior critical dimension accuracy and pattern resolution.
Scalable production: Ideal for both small-batch and high-volume manufacturing
Broad compatibility: Supports DUV, i-line, KrF, ArF, and EUV processes.
Global delivery: Rapid support and logistics from multiple worldwide manufacturing centers.
Reliability you can trust: Stable materials, consistent performance, and rigorous qualification.

Catalog

Technical Overview

Specification	Description
Mask Types	Binary, Halftone PSM, Alternating PSM, EUV Reflective
Minimum Feature Size	Sub-100 nm capability (process dependent)
Blank Materials	Quartz, OMOG, MoSi-based blanks, EUV multilayers
Wavelength Compatibility	i-line, KrF, ArF, EUV
Inspection	Advanced CD metrology, defect inspection, repair
Production Scope	Full mask set production, single-layer masks, R&D masks
Manufacturing Sites	Multiple global fabrication facilities

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Semiconductor & Equipment Solutions