Nano Systems Solution

DL-1000 Mask-less Lithography System

Accelerate micro-patterning. Simplify your workflow.

In micro-fabrication, every second counts and every mask adds cost, complexity, and delay. The DL-1000 eliminates the need for traditional photomasks by using a high-precision Digital Micro-mirror Device (DMD) to directly expose photoresist from your pattern data.

Faster prototyping and shorter lead times
Instant design flexibility
High-accuracy alignment without optical complexity
Reduced consumables and maintenance

Product Specifications

Key Features

Ultra-Fine Resolution
Achieve standard 1 µm resolution with options down to 0.5 µm or up to 2 µm depending on your application.
Flexible Exposure Modes
Supports both step-and-repeat and scanning exposure, giving you full control over how patterns are written.
Maintenance-Free Light Source
Equipped with a long-life LED or semiconductor laser light source to reduce downtime and running costs.
High Throughput
Patterning speeds exceed 2,000 mm² per minute, ideal for research and small-batch production.
Real-Time Autofocus
Maintains perfect focus even on warped or transparent substrates, ensuring consistent exposure quality.
Coaxial Observation and Alignment
Built-in cameras enable simultaneous observation of the substrate surface and exposure path for high-precision overlay.
Advanced Data Compatibility
Supports DXF, GDSII, and grayscale image files – perfect for both 2D patterning and 3D structuring.
Wide Substrate Range
Handles substrates from a few millimetres up to large-format sizes, suitable for a wide range of applications.

Applications

The DL-1000 is designed for versatility across industries and research fields, including:

Semiconductor prototyping and device development
MEMS and microfluidic fabrication
Optical and communication components
Photo-curable material studies
Micro-ID or selective exposure marking
Bio and life-science micro-patterning
Mix-and-match lithography workflows
Micro-moulds and compound semiconductor processes

Benefits to Your Workflow

No Photomasks Required: go from design to exposure instantly.
Flexible and Fast: modify patterns digitally for immediate iteration.
Cost-Efficient: lower operational and maintenance costs over time.
Precision Alignment: advanced optics and imaging ensure superior overlay accuracy.

Scalable: adaptable for small-scale R&D or larger production setups.

Catalog

Technical Overview

Specification	Description
Exposure Optics	Tele-centric illumination with DMD pattern generator
Minimum Feature Size	< 1 µm (option for < 0.5 µm)
Overlay Accuracy	≤ 0.5 µm (3σ typical)
Address Grid	As fine as 12.5 nm
Throughput	> 1,000 mm²/min (high-speed laser mode)
Light Source	Long-life LED or laser
Substrate Size	Several mm up to large wafer formats

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HTL Co. India Pvt. Ltd.

Semiconductor & Equipment Solutions